Deeply cultivate the bonding wire subdivision field and realize the differentiated marketing strategy
The enterprise deeply cultivates the field of bonding wire subdivision and realizes the differentiated marketing strategy. The products use high purity (99.99%~99.999% purity) gold, silver, palladium, copper and various rare and precious metal elements as raw materials, add proprietary alloy formula, and combine with unique production process to achieve international leading product characteristics. The current diameter of the product is 30~10 μ m. The length of the single axis is at least 500 meters. It has a stable elongation (EL%) fluctuation range and a finished high-strength (BL) bonding wire. It is suitable for high-speed IC/LED wire bonding equipment. It has strong bonding tensile strength, excellent chip electrode bonding, and stable reliability.